 |
SMT Lead Forming Equipment |
|
Universal SMT trim & form systems Dedicated trim & form systems Progressive tooling for plastic packages on lead frames DIPs to SMDs Lead cutters Optical component forming TO can forming TAB excise and form Standard Footprints Custom Applications Blank Quadpack Specification Sheet (PDF) One-Sided Package Specification Sheet (PDF) Blank Flatpack Specification Sheet (PDF) Omega Bend Specification Sheet (PDF) DIP to SMD Specification Sheet (PDF) Click here to read instructions that will help you fill out these forms. |
| Component Preparation Services |
 |
Quick turnaround component preparation services for most packages to almost any surface-mount footprint with optional tinning and leak testing. |
| Matrix Trays |
 |
Unique matrix trays with adjustable slides to hold a variety of two- and four-sided SMT devices. |
| Presses |
 |
Bench-top air presses delivered ready to run with all controls, and hand-arbor presses for a variety of forming, staking or cutting procedures. |
| Standoff Measuring Instrument |
 |
Simple, accurate instrument to measure the standoff height on a formed SMD, and lead egress position on an unformed component. |
| Coplanarity Mirror |
 |
A simple device for visually inspecting the leads on a formed gullwing component. |
| HP-100 Vacuum Pen |
 |
Powerful vacuum pen for handling components. |