SBGA SuperBGA®
Super Ball Grid Array 1.27mm
SuperBGA®
Package is a very low profile, high-power BGA. The IC is directly
attached to an integrated copper heat sink. Since the IC and the I/O are
on the same side, signal vias are eliminated.
|
 |
| Part Number |
I/O Count |
Pitch |
Body Size |
Ball Matrix |
Ball Alignment |
Quantity Per Tray |
| A-SBGA168-1.27mm-23mm |
168 |
1.27mm |
23mm |
17 x 17 |
Perimeter |
60 |
| A-SBGA256-1.27mm-27mm |
256 |
1.27mm |
27mm |
20 x 20 |
Perimeter |
40 |
| A-SBGA304-1.27mm-31mm |
304 |
1.27mm |
31mm |
23 x 23 |
Perimeter |
27 |
| A-SBGA352-1.27mm-35mm |
352 |
1.27mm |
35mm |
26 x 26 |
Perimeter |
24 |
| A-SBGA432-1.27mm-40mm |
432 |
1.27mm |
40mm |
31 x 31 |
Perimeter |
21 |
| A-SBGA520-1.27mm-40mm |
520 |
1.27mm |
40mm |
31 x 31 |
Perimeter |
21 |
| A-SBGA560-1.27mm-42.5mm |
560 |
1.27mm |
42.5mm |
33 x 33 |
Perimeter |
12 |
| A-SBGA600-1.27mm-45mm |
600 |
1.27mm |
45mm |
35 x 35 |
Perimeter |
12 |
See
Cross Section Drawing and Solder Information
- Superior thermal performance.
- Light weight
- Low profile (1.4mm mounted)
- Moisture resistant (JEDEC level 3)
- JEDEC MO-192 standard outlines
- Enhanced electrical performance > 1 GHz
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- BGA packages should be baked at 125°C for 24 hours prior to assembly to
prevent delamination during assembly process.
- Parts can be baked and dry-packed.
- All components are daisy-chained except for 520 I/O.
