PBGA Plastic Ball Grid Array
 PBGA
1.0mm Pitch PBGA
1.5/1.27mm Pitch
Amkor PBGAs incorporate advanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability. |
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PBGA 1.0mm PitchPBGA
Dummy Components |
| Part Number | I/O Count | Pitch | Body Size |
Ball Matrix |
Ball Alignment |
Quantity Per Tray |
| A-PBGA144-1.0mm-13mm | 144 | 1.0mm | 13mm | 12 x 12 | Full Grid | 160 |
| A-PBGA156-1.0mm-15mm | 156 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| A-PBGA160-1.0mm-15mm | 160 | 1.0mm | 15mm | 14 x 14 | Perimeter | 126 |
| A-PBGA192-1.0mm-17mm | 192 | 1.0mm | 17mm | 16 x 16 | Perimeter | 90 |
| A-PBGA196-1.0mm-15mm | 196 | 1.0mm | 15mm | 14 x 14 | Full Grid | 126 |
| A-PBGA208-1.0mm-17mm | 208 | 1.0mm | 17mm | 16 x 16 | Perimeter | 90 |
| A-PBGA256-1.0mm-17mm | 256 | 1.0mm | 17mm | 16 x 16 | Full Grid | 90 |
| A-PBGA288-1.0mm-23mm | 288 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
| A-PBGA289-1.0mm-19mm | 289 | 1.0mm | 19mm | 17 x 17 | Full Array | — |
| A-PBGA324-1.0mm-23mm | 324 | 1.0mm | 23mm | 22 x 22 | Perimeter | 60 |
| A-PBGA416-1.0mm-27mm | 416 | 1.0mm | 27mm | 26 x 26 | Perimeter | 40 |
| A-PBGA456-1.0mm-27mm | 456 | 1.0mm | 27mm | 26 x 26 | Perimeter | 40 |
| A-PBGA484-1.0mm-27mm | 484 | 1.0mm | 27mm | 26 x 26 | Perimeter | 40 |
| A-PBGA516-1.0mm-31mm | 516 | 1.0mm | 31mm | 30 x 30 | Perimeter | 27 |
| A-PBGA580-1.0mm-35mm | 580 | 1.0mm | 35mm | 34 x 34 | Perimeter | 24 |
| A-PBGA676-1.0mm-27mm | 676 | 1.0mm | 27mm | 26 x 26 | Full Grid | 40 |
| A-PBGA680-1.0mm-35mm | 680 | 1.0mm | 35mm | 34 x 34 | Perimeter | 24 |
| A-PBGA928-1.0mm-40mm | 928 | 1.0mm | 40mm | 39 x 39 | Perimeter | 21 |
| A-PBGA1156-1.0mm-35mm | 1156 | 1.0mm | 35mm | 34 x 34 | Full Array | 24 |
See
PBGA Drawings and Solder Information
- Overall thickness of 1.0mm pitch PBGA packages will vary (please call for more details).
- Parts are packaged in JEDEC trays.
- Call for tape and reel quantity and availability.
- Solder ball material is eutectic 63/37 SnPb.
- All components are daisy-chained.
- Daisy-chained connections are connections between I/O(input/output) of the component.
- BT (Bismaleimide-Triazine) substrates.
- JEDEC MS-034 standard outlines.
- Ball diameter varies (see chart).
- BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
- Lead-free parts are available.
