|
High Temperature Epoxy Encapsulating and Potting
Compound |
 |
For
encapsulating and potting electronics in high temperature environments,
aggressive chemical environments, or where improved technology protection
is desired. Bonds to a wide variety of substrates, including metals,
glass, ceramics and many plastics.
Features / Benefits
- Extreme physical strength and chemical resistance
- Suitable for extreme environments, such as submersion in salt water,
acids, bases, fuels, and alcohols
- Protects against strong vibrations, abrasions, and direct physical
impact
- Extremely difficult to remove - grants incredible technology
protection
- Maximum service temperature of 275°C (527°F)
Typical Applications
- Use in electronic assemblies to prevent vibration damage
- Encapsulate circuits for the purpose of technological protection
| Cured Properties - Physical |
Test Method |
Result |
|
Viscosity at 20 ºC (68 ºF) (Part A)
|
54,800 cps
|
|
Viscosity at 20 ºC (68 ºF) (Part B)
|
11,000 cps
|
|
Mixed Viscosity at 20 ºC (68 ºF)
|
40,000 cps
|
|
Mixing Ratio by Volume
|
2.0 : 1.0
(Part A: Part B)
|
|
Mixing Ratio by Mass
|
2.186 : 1.000
(Part A: Part B)
|
|
Maximum Service Temperature
|
275 ºC (527 ºF)
|
|
Maximum Intermittent Temperature
|
300 ºC (572 ºF)
|
|
Working Time (100 gram sample)
|
1 hour
|
|
Cure time at 20 ºC (68 ºF)
|
24 hours
|
|
Cure time at 65 ºC (149 ºF)
|
1 hour
|
|
Hardness, Shore D
|
80
|
|
Tensile Strength
|
ASTM-D-638-02a
|
7,861 PSI
|
|
Elongation
|
ASTM-D-638-02a
|
3.38%
|
|
Compressive Strength
|
ASTM-D-695-02a
|
11,870 PSI
|
|
Flexural Strength
|
ASTM-D-790-03
|
14,600 PSI
|
|
Flexural Modulus
|
ASTM-D-790-03
|
399,000 PSI
|
|
Lap Shear Strength
|
ASTM-D-1002-01
|
1,794 PSI
|
|
Coefficient of Thermal Expansion
|
ASTM-D-648-01
|
|
 -40
ºC to 50 ºC |
75.7x10-6 mm/mmºC |
| +100
ºC to +250 ºC |
154.0x10-6 mm/mmºC
|
| -40
ºC to +250 ºC |
125.3x10-6 mm/mmºC
|
| +25
ºC to + 250 ºC |
140.2x10-6 mm/mmºC
|
|
Deflection Temperature Under Load
|
ASTM-D-648-01
|
53.9 ºC (129.02 ºF)
|
|
Dielectric Constant
|
ASTM-D-150-98
|
4.24 @ 60 Hz
|
|
Dissipation Factor
|
ASTM-D-150-98
|
0.0018 @ 60 Hz
|
|
Volume Resistivity
|
ASTM-D-257-99
|
9.3 x 1015 ohm · cm
|
|
Surface Resistivity
|
ASTM-D-257-99
|
5.3 x 1013 ohm
|
|
Dielectric Strength
|
ASTM-D-149-97a
|
1,138 volts / mil ! 0.020”
|
|
Thermal Conductivity
|
ASTM-E-1530-99
|
0.210 W/mºK
|
|
Thermal Conductivity @ 25 ºC (77ºF)
|
ASTM-E-1461-92
|
0.218 W /mºK
|
|
Thermal Diffusivity @ 25 ºC (77 ºF)
|
ASTM-E-1461-92
|
1.33 x 10-13 M2/s
|
|
Specific Heat Capacity @ 25 ºC (77 ºF)
|
ASTM-E-1269-01
|
1419 J/kgºK
|
| Part Number |
Sizes Available |
Description |
| 832HT-375ML |
375ml (12 oz) |
Liquid |
| 832HT-3L |
3L (0.8 gal) |
Liquid |
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