TABGA TapeArray™ Ball Grid Array
| The TapeArray™
package is a near chip scale (CSP). The package has a die-up,
wire bonded configuration with a flexible circuit substrate and an
over-molded body. The TapeArray™ expands the existing packaging of the
fleXBGA® by streamlining the assembly process into an
array strip format.
The package is then singulated by saw as part of the EOL process. The fine line features of the tape substrate offer reduced conductor and wirebond finger pitch to offer the highest I/O density solutions for a wide range of applications. |
  
BGA Fine Pitch Kits |
| Part number | I/O Count | Pitch | Body Size | Ball Matrix | Ball Alignment | Quantity Per Tray |
| .5mm Pitch | ||||||
| A-TArray48-.5mm-5mm | 48 | .5mm | 5mm | 8 x 8 | Perimeter | — |
| A-TArray64-.5mm-6mm* | 64 | .5mm | 6mm | 8 x 8 | Full Array | 608 |
| A-TArray80-.5mm-7mm | 80 | .5mm | 7mm | 12 x 12 | Perimeter | 476 |
| A-TArray84-.5mm-6mm* | 84 | .5mm | 6mm | 10 x 10 | Perimeter | 608 |
| A-TArray96-.5mm-8mm* | 96 | .5mm | 8mm | 14 x 14 | Perimeter | 360 |
| A-TArray112-.5mm-7mm | 112 | .5mm | 7mm | 12 x 12 | Perimeter | 476 |
| A-TArray132-.5mm-8mm* | 132 | .5mm | 8mm | 14 x 14 | Perimeter | 360 |
| A-TArray228-.5mm-12mm* | 228 | .5mm | 12mm | 22 x 22 | Perimeter | 198 |
| .8mm Pitch | ||||||
| A-TArray49-.8mm-6mm | 49 | .8mm | 6mm | 7 x 7 | Full Array | 608 |
| A-TArray64-.8mm-8mm | 64 | .8mm | 8mm | 8 x 8 | Full Array | 360 |
| A-TArray81-.8mm-8mm | 81 | .8mm | 8mm | 9 x 9 | Full Array | 360 |
| A-TArray100-.8mm-9mm | 100 | .8mm | 9mm | 10 x 10 | Full Array | 308 |
| A-TArray112-.8mm-10mm* | 112 | .8mm | 10mm | 11 x 11 | Perimeter | 250 |
| A-TArray132-.8mm-12mm* | 132 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| A-TArray144-.8mm-10mm* | 144 | .8mm | 10mm | 12 x 12 | Full Array | 250 |
| A-TArray180-.8mm-12mm* | 180 | .8mm | 12mm | 14 x 14 | Perimeter | 198 |
| A-TArray192-.8mm-14mm | 192 | .8mm | 14mm | 16 x 16 | Perimeter | — |
| A-TArray220-.8mm-14mm | 220 | .8mm | 14mm | 16 x 16 | Perimeter | — |
| 1.0mm Pitch | ||||||
| A-TArray-100-1.0mm-11mm | 100 | 1.0mm | 11mm | 10 x 10 | Full Array | — |
| A-TArray-256-1.0mm-17mm* | 256 | 1.0mm | 17mm | 16 x 16 | Full Array | 90 |
See TapeArray
Cross-Section and Solder Information
- * = DC Available.
- Parts are packaged in JEDEC-trays when available.
- Solder ball material is Eutectic 63/37 SnPb.
- 48 to 256 ball counts.
- 5 to 17mm sq. body sizes.
- 1.1mm mounted height for 1.0mm and 0.8mm ball pitches.
- 1.0mm mounted height for 0.5mm ball pitch.
- 1.0, 0.8, and 0.5mm ball pitches.
- Excellent solder joint reliability.
- Superior moisture resistance performance.
- Some components are available daisy-chained. Call for details.
- JEDEC Compliant
MO-195 — 0.5mm pitch
MO-216 — 0.8mm pitch
MO-192 — 1.0mm pitch - Lead-free parts are available.