PBGA packages are designed for low inductive, improved thermal operation and enhanced SMT ability. PBGA packages are ideal for microprocessors/controllers, ASICs, gate arrays, memory, DSPs and PC chip set applications. PBGA packages consist of a BT (Bismaleimide-Triazine) substrates with eutectic (63/37) solder balls attached. Solder ball pitches are 1.0mm, 1.27m and 1.5mm. Solder Ball patterns can come perimeter, staggered or full ball array. Body sizes can range from 13mm to 45mm. PBGAs are JEDEC standard outlines

PBGA — Plastic Ball Grid Array (1.0mm Pitch)

• Overall thickness of 1.0mm pitch PBGA packages will vary in size (please call for more details).
• Parts are packaged in JEDEC trays.
• Call for tape and reel quantity and availability.
• Solder ball material is eutectic 63/37 SnPb.
• Some components are daisy-chained (please call for more details).

• Daisy-chained connections are connections between I/O (input/output) of the component.
• BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.
• Parts can be baked and dry-packed.

• Parts are packaged in JEDEC-trays.
• Call for tape and reel quantity and availability.
• Solder ball material is eutectic 63/37 SnPb.
• Daisy-chain connections are connections between I/O (input/output) of the component.
• BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during the assembly process.

• Daisy-chain connections are used, paired with a PC board that has complimentary connections between pads in order to test for continuity.
• Parts can be baked and dry-packed.
• Most PBGA packages are assembled with “dummy” die to simulate the CTE of live parts.
• Some components are daisy-chained (please call for more details).