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X-106 Full Convection Mini Oven                                                                                                         x-kar.jpg


     Especially designed for Re-Balling and LEAD FREE Soldering of boards up to size 6”x 4.7”.

         Model X-106 AC incorporates fast cooling to solidify molten solder in 60 seconds or less. 

The X-106 MiniOven was designed primarily for even, through convection fast heating of the IC’s during re-balling. It provides full profiling, nitrogen environment and exceptionally accurate process control. With the operating mode bd-t (object or board temperature control), the oven will deliver hot air or nitrogen to achieve desired temperatures of the surface where the thermocouple is attached.  

               Mini Oven 1 M.jpg                                         x-106 na strone M.jpg


Input Voltages

220-240V AC  50/60 Hz    110-120V AC 50/60 Hz

Power Consumption



8A for 220-240V,   16A for 110-120V
Slow-Blow 6mm x 32mm

Heater Control

PID, Closed-Loop Thermocouple sensor feedback

Reflow area

160x120x40 mm    (6.3”x4.7”x1.57”)

Temperature range

30 ºC – 350 ºC      (86 ºF – 662 ºF)

Temperature Zones

Preheat1, Preheat2, Soak, Reflow, Cooling – Total of 5 (five) zones


2 Heaters (Front and Rear) 1.0kW programmed independently  

Max. PCB size

160 x 160 mm     (6” x 6”)

Communication with PC

RS485 port ( XKAR X485-USB converter required to connect to PC USB port)


8kg  (17.7 lbs.)

System dimensions

440mm x 225mm x 210mm     (17.3” x 8.8” x 8.3”)

Packaged weight

10kg      (22.1 lbs.)

      Instruction Manual - Download


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Order Now Part Number Description Price
X-106AC MiniOven-120V Full Convection Mini Oven with N2 input for reflow of small boards and Re-balling. Has built-in accelerated cooling by shop air or N2. Basic Model without fast cooling - Price 1679.90
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